Documenting the Coming Singularity

Sunday, September 18, 2011

Want processors 1000 times faster? Use this glue.

Mashable - 9/9/11 by Charlie White

If you want to make processors 1,000 times faster, you’re going to need some serious technology, right? That would be the conventional wisdom. But 3M and IBM have unlocked a secret low-tech shortcut.

The companies found a much simpler way to hit that elusive goal — not by creating some spectacular new circuitry or using exotic quantum mechanics, but with the invention of a new variety of a mundane substance: glue.

This is not just any glue. It’s an adhesive that dissipates heat so efficiently that layer upon layer of chips can be stacked on top of each other into silicon “towers” up to 100 layers high, glued together with this special adhesive that keeps things cool. The result? Faster chips for computers, laptops, smartphones and anything else that uses microprocessors.

With IBM supplying its microprocessor and silicon expertise and 3M contributing its super-cool adhesive, the two companies aim to stack together processors, memory chips and networks into monster “skyscrapers” of silicon they say will be 1,000 times faster than today’s fastest processor.

Read more>>

An online PhD is of interest to some people who want to pursue deeper knowledge of this.

Follow me on Twitter. Please subscribe to our news feed. Get regular updates via Email. Contact us for advertising inquiries.


Anonymous said...

There goes my Core i7 2600K...

Anonymous said...

So it's a glue that rolls back the first law of thermodynamics?

Or, does the heat still have to go somewhere? 1000x the heat generated means the computer will be basically a nuclear reactor sitting on your lap. Let's hope when they say the heat is "dissipated" they mean "into another dimension".